Abstract Submission Guidelines
1) Abstract MUST be submitted online through the EMAP2013 website by June 15, 2013 for oral and poster presentations.
2) Abstract MUST be written in English ONLY.
3) Abstract must not have been published or submitted for presentation to any national and/or international meeting before the EMAP2013.
4) The total length of the abstract must not exceed 300 words.
5) Acknowledgement of your abstract submission will be sent to the presenting/corresponding authors' email addresses.
6) Acceptance notification will be sent to the corresponding author by July 15, 2013.
7) Modifications may be made before the abstract submission system is closed.

Journal Publication
After peer review and author's revision, selected papers will be published in the Electronic Materials Letters (SCIE, impact factor 1.819) or Journal of the Microelectronics and Packaging Society (KCI).

Abstract should include the following scopes:
1. Electronic Materials and Processing
2. Optoelectronic and Photonic Materials and Processing
3. Pb-Free Solders and Emerging Interconnect Technologies
4. Advanced Packaging Technologies
5. 3D Integration and Packaging
6. LED Packaging and Applications
7. MEMS Packaging and Applications
8. Modeling & Simulation
9. Quality and Reliability

*EMAP 2013 Website Click!

* Secretariat of EMAP2013

Tel: +82-2-565-3571

Mobile: +82-10-9156-3571

E-mail: emap2013@kmeps.or.kr