WELCOME MESSAGE

Dear Colleagues,

It is our pleasure to announce that the 15th International Conference on Electronic Materials and Packaging (EMAP 2013) will be held at KINTEX (Korea International Exhibition Center) convention center, Seoul/Ilsan, Korea, on October 6-9, 2013.

This international conference is organized by KMEPS (the Korean Microelectronics and Packaging Society). During this event, the 15th International Semiconductor Exhibition (i-SEDEX 2013: http://www.sedex.org) will be held at KINTEX. EMAP 2013 will be held jointly with the 12th International Symposium on Microelectronics and Packaging (ISMP 2013).

The purpose of EMAP2013 is to provide a comprehensive coverage of recent advances in materials, processing, design, simulation, reliability and packaging. This will also provide an excellent opportunity for researchers and engineers to discuss recent advances and new research directions. Scientists, engineers, researchers, and students from universities, research institutes, and related industrial companies are cordially invited to submit abstracts and to participate in the conference.

The organizing committee eagerly awaits your participation in EMAP 2013 and look forward to welcoming you in Seoul, Korea.

Young-Ho Kim
Professor of Hanyang University
General Chair of EMAP2013  

Chang-Ho Choi
HANA Micron
General Co-Chair of EMAP2013

Abstract Submission Guidelines
1) Abstract MUST be submitted online through the EMAP2013 website by June 15, 2013 for oral and poster presentations.
2) Abstract MUST be written in English ONLY.
3) Abstract must not have been published or submitted for presentation to any national and/or international meeting before the EMAP2013.
4) The total length of the abstract must not exceed 300 words.
5) Acknowledgement of your abstract submission will be sent to the presenting/corresponding authors' email addresses.
6) Acceptance notification will be sent to the corresponding author by July 15, 2013.
7) Modifications may be made before the abstract submission system is closed.

Journal Publication
After peer review and author's revision, selected papers will be published in the Electronic Materials Letters (SCIE, impact factor 1.819) or Journal of the Microelectronics and Packaging Society (KCI).

Abstract should include the following scopes:
1. Electronic Materials and Processing
2. Optoelectronic and Photonic Materials and Processing
3. Pb-Free Solders and Emerging Interconnect Technologies
4. Advanced Packaging Technologies
5. 3D Integration and Packaging
6. LED Packaging and Applications
7. MEMS Packaging and Applications
8. Modeling & Simulation
9. Quality and Reliability

*EMAP 2013 Website Click!

* Secretariat of EMAP2013

Tel: +82-2-565-3571

Mobile: +82-10-9156-3571

E-mail: emap2013@kmeps.or.kr